| 摘要 |
PURPOSE:To manufacture the high-density thick film IC plate in a good yield and low price by a method wherein an insulation layer is printed and baked in two times. CONSTITUTION:Conductor paste of Ag-Pd system is printed and baked on a ceramic substrate 1, the first wiring conductor 2 being formed, resistor paste of RuO2 system being printed and baked so as to be connected to the conductor 2 to form the first layer resistor 3. Then, insulator paste containing the crystallized glass printed and baked so as to cover those mentioned above to form an insulator first layer 4-1. Thereafter, the first layer resistor 3 is trimmed by laser and the insulator paste is printed and baked again to form an insulator second layer 4-2 and to form an insulator layer 4. Thereafter, the conductor paste of the Ag-Pd system is printed, and the resistor paste of the RuO2 system is printed and baked, thereby, permitting the second layer wiring conductor 5 and the second resistor 6 to be formed. |
