METHOD OF FORMING PATTERN FOR CONNECTING PART WITH SOLDER PASTE,申请号JP19800060656-传众专利搜索

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发明名称	METHOD OF FORMING PATTERN FOR CONNECTING PART WITH SOLDER PASTE
摘要
申请公布号	JPS56157092(A)	申请公布日期	1981.12.04
申请号	JP19800060656	申请日期	1980.05.09
申请人	HITACHI LTD	发明人	TAKAI TERUO
分类号	H05K3/34;B23K1/00;B23K1/20;H05K3/22	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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