| 发明名称 |
The manufacture of ceramic circuit substrates. |
| 摘要 |
<p>Gold balls 9 are pressed into and embedded in a green sheet 2. This effectively provides, in a single step process, the formation and filling of via holes in the green sheet 2. …<??>The green sheet 2 is carried by a tray 1. A mould or ball arranging plate 8 is placed on the green sheet 2 and gold balls 9 are introduced into holes in the mould or plate 8. The gold balls 9 are pressed down into and embedded in green sheet 2 by a force piston 10.</p> |
| 申请公布号 |
EP0040905(A1) |
申请公布日期 |
1981.12.02 |
| 申请号 |
EP19810301493 |
申请日期 |
1981.04.07 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
YOKOUCHI, KISHIO;OGAWA, HIROMI;YOKOYAMA, HIROMITSU;KAMEHARA, NOBUO;NIWA, KOICHI;MURAKAWA, KYOHEI |
| 分类号 |
H05K3/46;H01L21/48;H01L23/15;H01L23/538;H05K1/03;H05K1/09;H05K3/40;(IPC1-7):01L21/48;03K3/00;01L23/54;01L23/14 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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