| 摘要 |
PURPOSE:To obtain the multipurpose package generating no short-circuiting at the circumference of connection of the semiconductor device by a method wherein in a concave part of the package main body being provided with inside wirings and the concave part for the equipment of the semiconductor device, a frame having metal parts to be connected to the inside wirings is inserted to be integrated in one body with the main body. CONSTITUTION:The concave part 2 for the equipment of the device is provided at the center of a ceramic laminate 1, and end parts of the inside wirings 3 are led out to the sides to form terminals 3a. The frame member 5 is formed utilizing a punched part of rubbverlike plate of the ceramic, and the wiring metals 6 are soldered 10 on the frame 5 corresponding to the inside wirings 3 to constitute inside leads 7. A metal 8 at the lower face of the frame and a metal face 4 of the equipping part of the package main body 1 are soldered to fix the frame. By this constitutinon, the package can be applied in common for plural kinds of semiconductor devices without generating short-circuiting at the circumferential part, and to change the package with each kind of semiconductor becomes needlessly. |
