发明名称 MANUFACTURE OF CERAMIC PACKAGE
摘要 PURPOSE:To prevent the deformation and the poor soldering of external leads by temporarily pressure welding by heating a solder material to the fixed position of the tips of external leads wherein the external leads are soldered to pads for installing the leads of a multilayer ceramic substrate. CONSTITUTION:Silver solder ribbons 5 are set in the groove 13 of a carbon jig 12 and lead plates 7 are engaged with guide pins 8 for positioning and a predetermined weight 10 is placed through carbon frames 9 and heat is applied under a reducing atmosphere to pressure weld the silver solder ribbons 5 by heating to the tips of external leads 6. Next, the pads 1 of a ceramic substrate 2 are placed in the groove 4 of a carbon jig 3 and directed to upward. The lead plates 7 with the silver solder ribbons are set on the basis of guide pins 8 to match the pads 1 with the tips of the leads 6. The weight 10 is placed to heat under the reducing atmosphere and the tips of the leads 6 are soldered 5' on the pads. Finally, the leads 6 are cut at a predetermined position. In this composition, workability is good and a yield is also improved.
申请公布号 JPS56155559(A) 申请公布日期 1981.12.01
申请号 JP19800058803 申请日期 1980.05.02
申请人 FUJITSU LTD 发明人 SUGIMOTO MASAHIRO
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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