发明名称 DEVICE FOR TRANSFER MOLDING
摘要 PURPOSE:To control the implanting pressure of resin as well as to perform a hermetical sealing of the resin by a method wherein a pressure detector is installed in such manner that it is exposed at a section on the passage where the resin is pressure-feeded to the cavity on which the material to be formed is inserted. CONSTITUTION:In the device with which a forming and sealing work is performed on electronic parts and the like, the pressure detector 10 is installed at a section on the runner 4 with which the resin is guided to a cavity 5 through a pouring hole 3. A cavity 6 is installed at the end section of the detector 10 having a built-in sensor on an elastic container 7 and oil 8 filled in, and the detector 10 is installed at the lower section of the cavity 6 in such manner that the detector is in exposed state. Accordingly, the pressure of the implanted resin is detected and the implanting pressure can be controlled at a proper value by operating a controlling circuit 12 in accordance with the detected value. Through these procedures, the breakage of the wire and the like on the sealed element can be prevented and the resin sealing can be performed harmetically.
申请公布号 JPS56155539(A) 申请公布日期 1981.12.01
申请号 JP19810023031 申请日期 1981.02.20
申请人 HITACHI LTD 发明人 NISHIDA SUMIO;OKIKAWA SUSUMU;WAKASHIMA YOSHIAKI
分类号 H01L21/56;B29C43/00;B29C45/00;B29C45/02;B29C45/14;B29C45/26;B29C45/76;B29C45/77 主分类号 H01L21/56
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