发明名称 HEAT CONDUCTIVE SURFACE
摘要 PURPOSE:To obtain a heat conductive surface of high heat conductivity by a method wherein the surface of a heat conductive substrate is made to have convex and concave portions and particles are piled up thereon, and fixed to the concave portion so that a porous layer is produced on the surface of the heat conductive substrate. CONSTITUTION:The surface 2 of the heat conductive substrate is made to have convex and concave portions. The particles 7 are piled up on the concave portion 9 and the surface 2 of the heat conductive substrate having the particles thereon is immersed in a plating liquid so that a metallic film 8 is formed over the surface 2 with the result that the particles 7 are fixed to the concave portion 9 to produce the porous layer 3 which acts as the heat transfer surface 4. Thus, it is possible to form on a heat coductive substrate a porous layer of a desired configuration which acts as a heat conductive surface of high heat conductivity.
申请公布号 JPS56155397(A) 申请公布日期 1981.12.01
申请号 JP19800057612 申请日期 1980.04.29
申请人 MITSUBISHI ELECTRIC CORP 发明人 MORIHIRO YOSHIYUKI;TSUKAO RIYUUSAKU
分类号 F28F13/02;F28F1/16;F28F13/00;F28F21/08 主分类号 F28F13/02
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