| 摘要 |
<p>The present invention relates to a method of manufacturing of a discrete electronic device. According to the method, discrete electronic devices are distributed across a surface of a conductor element such that at least some of the contact surfaces of the electronic devices contact the electrodes of the conductor element. In addition, all dimensions of each contact surface of the electronic device are smaller than a width of the gap between the electrodes of the conductor element so that no contact of an electronic device contacts more than one electrode of the conductor element.</p> |
