发明名称 Low temperature microwave annealing of semiconductor devices
摘要 Briefly, and in general terms, the present invention provides a process for fabricating a semiconductor device, the device includes a semiconductor substrate having a major surface including an ion implanting region, wherein one fabrication step in the process subsequent to the formation of the ion implantation region is to direct a beam of microwave radiation at the device for annealing the ion implanted regions.
申请公布号 US4303455(A) 申请公布日期 1981.12.01
申请号 US19800130509 申请日期 1980.03.14
申请人 ROCKWELL INTERNATIONAL CORPORATION 发明人 SPLINTER, MICHAEL R.;PALYS, RICHARD F.;BEGUWALA, MOIZ M.
分类号 H01L21/265;H01L21/324;(IPC1-7):H01L21/26 主分类号 H01L21/265
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