| 摘要 |
Novel imide resins are prepared by reacting a mixture of a bisimide of an unsaturated dicarboxylic acid and a monoimide with a dihydrazide of a dicarboxylic acid, preferably in an organic solvent or diluent at elevated temperature for a period of time insufficient to yield an insoluble, infusible, fully cured imide resin. Solutions of the resulting prepolymerization product are stable at room temperature and their viscosity remains substantially unchanged for a prolonged period of time. Fully cured imide resins and articles thereof of a high heat resistance are obtained by heating said prepolymerized imide resin or materials such as fibers, metal wire webs, and others impregnated therewith, if desired, in the presence of curing catalysts, inhibitors, fillers and other materials to curing temperature up to 350 DEG C.
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