| 摘要 |
PURPOSE:To obtain low resistant quality for a conductive pattern at a low cost by exposing a part of the conductive pattern to cover with a protective layer wherein the exposed part is covered with solder. CONSTITUTION:A pattern 15 having pad sections 12, 13 and a conductive section 14 is made on a ceramic substrate 11. Next, a glass layer 17 having a window 16 exposing the upper surface and the periphery of the conductive section 14 is stacked. The window 16 is filled with solder pasted and the solder pasted is applied on the surface of an external lead terminal for heating and a solder layer 18 is made on the surface of the substrate 11 exposed to the exposed section and the periphery of the conductive pattern 16. Therefore, the pads 12, 13 are connected by the conductive section 14 and the solder 18 and the area of the section increases to the side of the conductive section 14 and the upper parts to extend the area. In this way, a part of a protective films is replaced with the solder layer to compose a laminate of the conductive pattern and the solder alyer. Then, no Au is required and a conductive path with low resistance can be formed by combining with inexpensive Ag-Pd and solder. |
