| 摘要 |
PURPOSE:To form the semiconductor device in a thin type by a method wherein a chip is put in the hole of a substrate, the bottom of the hole is blocked with a metal plate, and is sealed with a resin after wiring is finished. CONSTITUTION:The wirings 3 are provided preliminary on a substrate 1 according to the prescribed pattern, the hole to put the chip therein is dug at the place in the substrate 1 wherein the semiconductor chip is to be put, and the hole is blocked from one side face with the metal plate 6 of Al, etc. The semiconductor chip 2 is fixed to the metal plate 6 from the other face with a silver paste or an adhesive. The wiring 3 on the upper face of the substrate 1 and the connecting terminals of the chip 2 are connected by wire bonding with wires 4. Moreover the surface of the chip 2 is covered with a plastic mold resin 5 to be sealed. Accordingly the thin type semiconductor device can be obtained at a low cost. |
