| 摘要 |
PURPOSE:To inhibit the retention of chemicals used by a chip mounting process by fixing a second substrate, to which a hole section or a recessed section is formed, to a section coating the electrical connecting section of a chip fastened onto a first substrate, to which a pattern is shaped, and the pattern and bringing a printed substrate to a multilayer state. CONSTITUTION:An integrated circuit mounting section 2 and circuit patterns 3 are shaped onto a substrate 1 as a base substrate, and the mounting section 2 is plated with a metal (Au, etc.). The whole is washed for removing an impurity such as remaining and adhering alkali metallic ions, halogen ions, etc., and the substrate is baked and an integrated circuit (a chip) 4 is mounted to the mounting section 2 by using paste such as an Au-Si eutectic, and bonded by wires 6. The integrated circuit mounting section and wire bonding sections are coated (bonding may be used) by employing a synthetic resin 7, and baked for curing the resin. The printed substrate 1 in which the circuit patterns are shaped and the integrated circuit is mounted completely is used as the base substrate, and other printed substrates are laminated onto the substrate 1 by employing adhesives such as the resin, thus forming a laminated substrate. |
