| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent defective chips from occurring due to the position deviation of through-holes for lift-up pins provided on an electrode plate or a semiconductor substrate. SOLUTION: Four lift-up pins 170 for supporting a semiconductor substrate 110 and through-holes 124 of an electrode plate 120 are provided in a range of approximately 2 mm from the peripheral edge of the semiconductor substrate 110. Hence, if a uniformity occurs in the processing condition of the semiconductor substrate 110 due to the influence of the through-holes 124, this influence can be brought about on a portion not used as a final semiconductor chip. The top end (support member 172) of the lift-up pin 170 in the embodiment has a sloped guide surface 172B having an aligning function of the semiconductor substrate 110 and hence the electrode plate 120 can be set at a correct position, if there is a fine position deviation of the semiconductor substrate 110 carried by a robot arm unit 130.</p> |
