| 摘要 |
PURPOSE:To obtain a high quality pattern of a metal or inorg. matter having satisfactory adhesion to a substrate with superior productivity without using a compd. causing environmental pollution by forming an electrically conductive film on the substrate before plating or vapor deposition. CONSTITUTION:An electrically conductive film 2 of copper, silver or the like is formed on the surface of plastic substrate 1 by sputtering or other method and a required mask pattern 3 of thermosetting resin or the like is formed on the surface of the film 2 by screen printing or other method. A thin film pattern 4 of a metal or inorg. matter is then formed by electroplating, electroless plating or vapor deposition, the mask pattern 3 is removed and the electrically conductive film 2 is etched to a prescribed pattern. Thus, the desired pattern 5 can be obtd. |
