发明名称 PROCEDURE FOR COOLING OF ELECTRICAL COMPONENTS BY MEANS OF GAS AND A COOLING BODY
摘要 1. A process for cooling electric components by means of a gas and a cooling body having at least one outer surface intended for heat-conducting connection to the components to be cooled, wherein the gas flows in closed cooling channels formed by slots extending between cooling fins arranged at right angles to the outer surface, from inlet openings to outlet openings, characterised in that from the inlet openings, the cross-section of the slots increases, and that the gas is fed to the inlet openings (1d) under pressure and is expanded on flowing through the slots (1f) from the inlet openings (1d) to the outlet openings (1e).
申请公布号 EP0004333(B1) 申请公布日期 1981.11.25
申请号 EP19790100745 申请日期 1979.03.12
申请人 SIEMENS AKTIENGESELLSCHAFT BERLIN UND MUNCHEN 发明人 WEBER, JURGEN, DR.;SALANKI, TIBOR, DR.;SCHERBAUM, FRIEDRICH;HANGS, WERNER
分类号 F25D1/00;H01L23/36;H01L23/467;H01L23/473;H05K7/20;(IPC1-7):01L23/46 主分类号 F25D1/00
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