| 摘要 |
PURPOSE:To eliminate a defect of a semiconductor device when a semiconductor substrate is conveyed by forming a magnetic metallic film on the substrate, holding it with holding means having magnetic force and conveying it to a die bonding unit. CONSTITUTION:A film of iron-base transformation metal is plated or vapor-deposited on the back surface of a die to improve the wettability with solder, is attracted by an electromagnet 11 or a permanent magnet 12 provided at a collet 4, is conveyed to a die bonding unit, is then bonded, is released from the magnet, and returned to the original position. Thus, a defect caused by solder chips when the pellet is attracted by vacuum can be eliminated, and a trouble such as electrodes shortcircuit on the pellet can be also eliminated, and the metal can be securely conveyed. |
