发明名称 |
Non-contacting technique for electroplating X-ray lithography |
摘要 |
An apparatus and method for coating a substrate. An electrically conductive substrate is placed in an electrolytic bath with the surface to be coated facing the anode. The cathode is placed near but not touching the other side of the substrate and an electric potential is applied to both electrodes. Means are provided to prevent electroplating of the cathode.
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申请公布号 |
US4302316(A) |
申请公布日期 |
1981.11.24 |
申请号 |
US19800147662 |
申请日期 |
1980.05.07 |
申请人 |
THE PERKIN-ELMER CORPORATION |
发明人 |
NESTER, JAMES F. |
分类号 |
C25D5/00;C25D5/02;C25D7/00;C25D7/12;C25D17/06;C25D17/08;C25D17/10;H01L21/288;(IPC1-7):C25D17/06;C25D17/12 |
主分类号 |
C25D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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