CONDUCTIVE FINE PARTICLE AND CONDUCTIVE CONNECTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a conductive fine particle having a film layer of a suitable alloy composition using heat diffusion from multilayer structure and conductive connecting structure. SOLUTION: This conductive fine particle is composed of a fine particle of a basic material whoes surface is covered with one or more metallic layers, wherein at least one layer of the metallic layers is an alloy layer made by heat diffusion of metallic layers more than 2.