| 摘要 |
A semiconductor device is bonded to a contact finger pattern which is located in a continuous tape. A metal package cup is fabricated from metal stock so as to have a flat rim portion around its periphery. A plastic insulating sheet is punched so that it forms an overlapping cover for the flat rim and is attached thereto. The tape mounted semiconductor device is then bonded to the inside of the cup and the metal fingers bonded to the insulating sheet covering the flat rim. Provision is made for one of the fingers to connect to the cup. Then the device is encapsulated using one of two techniques. In the first a cap that mates with the cup is provided with a bonded insulating film cover and is bonded to the cup with its overlying metal fingers, so that a metal housing results. An encapsulating material is then injected inside the housing by way of a hole in the cap. Alternatively the semiconductor device can be covered by a suitable casting material. The active device leads can then be severed from the tape and formed into their ultimate form so that the device can be tested in tape form prior to being excised from the tape. |
