| 摘要 |
PURPOSE:To provide a contacting unit capable of being connected to an external unit in a high density package by improving a cooling structure to readily mount an LSI package, enabing to supply a large current and simplifying the cooling structure. CONSTITUTION:A power bus 11, a connecting connector 10 and an LSI package 4 are mounted to form a cooling air passage 14 by a fan 1 provided at the end of a multilayer substrate 2. This LSI pacakge 4 mounts a substrate 12, an LSI semiconductor element 5 carried on the substrate 12, contacting pins connected to a cable 3, the substrate 12 and the power bus 11 mechanically, and has screws 8 for supplying a voltage to the substrate 12, a cooling heat sink 9, and contacting pins 6. Cooling air is flowed by a fan 1 into the passage 14 to cool the semiconductor element 5 carried on the LSI package 4 through the heat sink 9. A signal can be transmitted via the contacting pins 7 directly between the LSI packages. |
