| 摘要 |
PURPOSE:To obtain a chip arranging method according to full automatic bonding, which is conducted at high speed, the rate of operation thereof is high and the accuracy of bonding positioning thereof is improved, by a method wherein acceptable IC chips are selected, and arranged and glued on a tray by using a positioning plate. CONSTITUTION:A tray 1 and a positioning plate 2 are stacked by fitting an IC positioning pin b and positioning hole. Only acceptable IC chips 3 are selected, pushed against the fixed corners of positioning windows and placed, and heated by means of a heating plate 17 and glued. The whole is cooled, and the positioning plate 2 is removed. Since the discrimination of the quality of the IC chips is not required and a discriminating time is removed from a cycle time, the chips are arranged at high speed, and full automatic bonding, the accuracy of position thereof is also high, is enabled. |
