| 摘要 |
PURPOSE:To improve the integration of a semiconductor device by bonding another semiconductor chip on a semiconductor chip mounted on a substrate. CONSTITUTION:A lead electrode 2 and a metallic layer 3 are formed on a substrate 1 made of insulator, and a package 4 is formed. A projected conductor electrode 9 is formed on the upper surface of the first semiconductor chip 15, bonded by solder on a metallic layer 3, and then the electrode of the chip 15 is bonded by a fine metallic wire to the lead electrode 2. The second semiconductor chip 16 on which the electrode 9 is formed is carried on the chip 15, the electrodes 9 of both chips 15 and 16 are contacted and bonded. Thus, the integration of the semiconductor device can be improved without increasing the difficult integration of the semiconductor chip therein. |
