| 摘要 |
<p>PURPOSE:To omit finishing and correction processes by applying an electrostatic coating method, forming resin powder for sheathing without adhesion and curing resin powder. CONSTITUTION:The top and under faces of a piezoelectric ceramic element 1 are held by a masking jig 10, on which resin powder is difficult to adhere and which is made of a resin, etc., and the powder of an insulating resin is attached onto the piezoelectric ceramic element 1 by an electrostatic coating machine, thus forming a resin powder layer 7. The resin powder of a lead mounting predetermined section is sucked and removed by a suction nozzle 11, an external electrode conductor layer 5 is exposed to a resin removing section 12, resin powder ashering on the masking jig 10 is gotten rid of, the resin powder layer 7 is melted and cured by an oven, etc., and the masking jig 10 is taken off. The external electrode conductor layer 5 exposed to the resin removing section 12 and leads 6 are connected with solder 8. An insulating film 9 is shaped onto the surface of solder 8, thus completing a piezoelectric ceramic laminate electronic part.</p> |
