| 摘要 |
PURPOSE:To absorb the stress resulting from the cure shrinkage of a sealing material by providing a thin plate between a case and the sealing material. CONSTITUTION:For example, a thin metal plate 5 (approximately 0.1mm.) is fitted into a case 1. Subsequently, a sealing material 2 such as epoxy resin and an IC- mounting substrate 3 are piled thereon and heated to melt the sealing material. When the heating is stopped, the sealing material starts curing, so that the substrate 3 is sealed. At this time, absorbing the stress resulting from the shrinkage of the sealing material 2, the thin metal plate 5 is deformed. Because the thin plate 5 is not secured to the inside of the case 1, the case bottom is not cracked or deformed at all. |
