Module power distribution network

摘要

The invention relates to a multi-layer module for packaging at least one electronic component. More specifically, it relates to the power distribution network design of an inductance reduced module. The multi-layer module comprises an uppermost electrically conductive layer on which the electronic component(s) are mounted, a plurality of electrically insulative layers, a plurality of electrically conductive layers, each being disposed between subsequent ones of said electrically insulative layers, said electrically conductive layers forming staggered placements of several at least three voltage and/or ground distribution layers close to the module surface without signal wiring layers in between, signal distribution layers comprising signal conductors and vias forming conductive paths through said insulative layers and said conductive layers, so that the corresponding signal, voltage and ground distribution layers are electrically connected with each other and with the uppermost layer. Furthermore the multi-layer module has a staggered placement of two voltage and ground distribution layers close to the module surface without signal wiring layers in between in connection with vias not arranged in local areas through the voltage and/or ground distribution layers to achieve the electrical effect of solid planes.