| 摘要 |
PURPOSE:To facilitate assembly of a semiconductor device by using as relay electrode plates metal plates each formed by uniting a first metal of good solderability with a second metal capable of wire bonding, and exposing the first and second metals to one surface. CONSTITUTION:Metal plates 21a and 41a of Cu or the like, which has solderability, and metal plates 21b and 41b of Al or the like, which is readily wire-bonded, are united to form relay plates 21 and 41 for a semiconductor device, respectively, and arranged on an insulating substrate 29 constituted from a carrier 27 and an insulator 28 united therewith, together with other conductor plates 31 and 51. As the insulator 28, a film formed by coating both surfaces of polyimide with fluoroplastic is effective. An SCR pellet 61 is soldered to the conductor plate 31, and the gate is connected 111 to the Al 21b of the relay plate 21. The Cu 21a is secured to a gate terminal conductor 81 by using a solder of Pb-Sn series. Then, by selectively effecting connection between the connecting portions of the specified materials, such as the connection 121 between the Al 41b and the cathode of the SCR, conventional relay plates can be eliminated, and assembly can be simplified. |
