发明名称 |
Flat shaped semiconductor encapsulation |
摘要 |
Electrodes are formed on one major surface of a semiconductor chip and electrically connected to lead electrodes carried by a support substrate. A cover plate is fixed to the opposing major surface of the semiconductor chip to determine one major surface of semiconductor device. Remaining surfaces of the semiconductor chip are encapsulated by a resin mold. The cover plate comprises a flexible glass cloth impregnated with half cured epoxy resin.
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申请公布号 |
US4300153(A) |
申请公布日期 |
1981.11.10 |
申请号 |
US19800190744 |
申请日期 |
1980.09.25 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
HAYAKAWA, MASAO;MAEDA, TAKAMICHI;KUMURA, MASAO |
分类号 |
H01L21/56;H01L23/31;(IPC1-7):H01L23/28;H01L39/02;H01L23/02 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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