| 摘要 |
PURPOSE:To prevent reduction in the sealing allowance at the glass sealing part of a semiconductor device and lowering of the mechanical strength and airtightness by providing the package cap with a means to absorb the gas generated from the chip coating material. CONSTITUTION:Of a cap 22 of a ceramic package, the inside which forms a sealing cavity 26 between a base 10 is to be a porous part 30 so that the capacity of the cavity 26 increases by the porous portion. Therefore, if CO2 or the like is generated from a polyimide resin 28 covering a chip by the heating in glass sealing, the gas is allowed to penetrate through the inner wall of the cap 22 and absorbed in the empty holes in the porous part. Accordingly, the rise in the pressure in the cavity resulting from the generated gas can be neglected, so that glasses 12 and 24 at the sealing part are not pushed out of the package. Therefore, the sealing allowance can maintain the maximum width, preventing lowering of the mechanical strength and airtightness at the sealing part. If the unglazed porous part is coated with a low-melting glass layer to form a vacuum porous part, it becomes more effective. Applying a gas absorbing material permits also a similar effect. |
