| 摘要 |
PURPOSE:To make the thickness of an optical circuit as thin as possible by disposing optical elements within the core layers of thick film optical transmission lines. CONSTITUTION:The 1st clad layer 13, core 10 and 2nd clad layer 15 of an optical fiber 7 are provided on a substrate 1. Light 14 from the optical fiber 7 is converted to a parallel light only at the plane direction with a medium 3 like thick film lense and is reflected with a plane refraction grating 8, then it is condensed with a thick film lens 5, and arrives at the photodetecting circuit of a solid-state image sensing element 9. Since the optical integrated circuit is disposed at a plane within these clad layers in this way, the electronic circuits are formable in one body as a hybrid integrated circuit on the substrate simply by increasing the film thickness of the optical elements, and the thin type optical integrated circuit formed with the optical circuits and electronic circuits in one body is obtainable. |
