| 摘要 |
A wafer cleaning apparatus is provided to reduce the time required for unloading wafers and to prevent cleaned wafers from being contaminated by separating a zone for transferring wafers before cleaning, from a zone for unloading cleaned wafers, and arranging openers and horizontal transfer robots for each zone. A wafer cleaning apparatus(100) comprises a first opener(118a), a second opener(118b), a first horizontal transfer robot(122A), a first wafer aligning unit(120A), a wafer cleaning unit(150), a second wafer aligning unit(120B), and a second horizontal transfer unit(122B). The first opener holds a carrier(C) containing wafers before a cleaning process. The second opener holds a carrier containing wafers after the cleaning process. The first horizontal transfer robot takes out the wafers to be cleaned from the carrier on the first opener. The first wafer aligning unit receives the wafers from the first horizontal transfer robot, having a first positioning device(124A) for positioning the wafers in a vertical state. The wafer cleaning unit receives the vertically standing wafers from the first wafer aligning unit for cleaning. The second wafer aligning unit receives the vertically standing wafers from the wafer cleaning unit, having a second positioning device(124B) for positioning the wafers in a horizontal state. The second horizontal transfer robot takes out the cleaned wafers from the second positioning device for placing the cleaned wafers in the carrier on the second opener.
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