METHOD OF RECYCLING DUMMY WAFER

摘要

A method of recycling dummy wafer is provided. The dummy wafer has at least one low-k dielectric material layer formed thereon. A treatment process is performed to the low-k dielectric material layer on the dummy wafer so that a component or impurity in the low-k dielectric material layer reacts to form a volatile substance. A wet etching process is performed to remove the low-k dielectric material layer.