| 摘要 |
PURPOSE:To assemble a semiconductor device with good working efficiency without contaminating nor damaging a semiconductor chip by providing a through hole to which the end of a collector lead can be inserted at a heat dissipating metallic plate. CONSTITUTION:A transistor chip 1 having a base electrode 1a, an emitter electrode 1b and a collector electrode 1c is soldered to a heat dissipating metallic plate 10, and an insulating substrate 4 having metallized layers 4a, 4b on both the surfaces is soldered to the plate 10 and a metallic bottom plate 5 of a package with solders 7, 8. When the end of the collector lead 3 is inserted into the through hole 10a of the plate 10 to solder the plate 10 to the metallized layer 4a of the substrate 4, it is simultaneously soldered to the plate 10. Thus, it can eliminate a work of cleaning or the like to remove the contaminated semiconductor chip and assemble the semiconductor device with good working efficiency. |
