| 摘要 |
A multilayer wiring substrate mounted with an electronic component and a method for manufacturing the same are provided to prevent the outflow of the sealing resin by filling a sealing resin by utilizing frame cut openings of the electronic component and a wire bonding section. A multilayer wiring substrate mounted with an electronic component(34) includes an electronic component, a core material layer, a resin layer, a plurality of connection conductor sections, a sealing resin, and a wiring pattern. The core material layer has a first opening for accommodating the electronic component. The resin layer is formed on one surface of the core material layer and has a second opening larger than the first opening. The connection conductor sections are provided around the first opening and within the second opening on the surface of the core material layer. The sealing resin is filled in the first and second openings so as to seal the electronic component and the bonding wire. The wiring pattern is formed on the sealing resin. |
