| 摘要 |
<p>PURPOSE:To prevent the wire short-circuiting, improve the manufacturing yield of semiconductor device, and enable the miniaturization of a lead frame, by sticking an insulating tape which expands by the effect of such heat as that at the time of sealing resin and heat of the same kind, on the rear of the lead frame. CONSTITUTION:In a lead frame 1 composed of Ni-Fe system alloy, Cu system alloy, etc., an insulating tape 12 is stuck on the opposite surface (rear surface) to the surface on which a chip 2 is fixed, with an adhesive agent and the like. On the surface of a tab 3 of the lead frame 1 on which the tape 12 is stuck, a chip 2 is fixed and a resin seal type semiconductor device 11 is obtained. In this resin molding process, the insulating tape 12 expands by the effect of heat, and protrudes through gaps between the leads 5 and between the lead 5 and the tab 3. These protruding parts 13 prevent the under loop of a bonding wire 9. Further the contacts of the wire 9 with chip 2, tab 3, lead 5 and tab lead 4 can be avoided.</p> |
