发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To connect a hollow pipe to a distribution pipe by a simple manner by providing two-stage expanded parts at the end part of the hollow pipe on the side of the distribution pipe, with a small distance being provided in the other direction from said end part, and holding the wall of a connecting hole of the distributing pipe between the two stages. CONSTITUTION:The hollow pipe 12 is inserted into a heat transporting pipe of a semiconducting device 11. Two stages of expanded parts 12A and 12B are provided on the hollow pipe 12 with a small distance being provided from the end. The part 12A is expanded to form a bugle shape, and the parts 12B are of an elastic tongue shape. The hollow pipe 12 and the parts 12B are made of Teflon and the like. A refrigerant-medium distributing pipe 13 has a hole 13A for inserting the hollow pipe and a connecting hole 13B at the top and bottom parts of the circumference. When the surrounding wall of the hole 13B is held by the parts 12A and 12B, the pipes are not separated. The outer periphery of the parts 13B is compressed by the elasticity of the parts 12B, and the parts 12A and 13B are engaged air-tightly. Therefore, the bubbles from the evaporator never enter the distributing pipe 13. In this constitution, the pipes can be quickly and precisely coupled together.
申请公布号 JPS56140651(A) 申请公布日期 1981.11.04
申请号 JP19800043772 申请日期 1980.04.02
申请人 MITSUBISHI ELECTRIC CORP 发明人 AKASHI HIROSHI;MIKANE TOSHIO;TETSUNO HARUO
分类号 H01L23/427 主分类号 H01L23/427
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