| 摘要 |
PURPOSE:To enable back side strain to be given uniformly to a great deal of wafers by abrasing the back surface of semiconductor wafers using abrasing particles and abrasing cloth in a simple manner. CONSTITUTION:The abrasing cloth 4 is adhered to a surface plate 5 to form one body. A plurality of the wafers 3 are fixed to the wafer fixing surface plate 1 via a bonding agent which is supplied on the top of the wafers. When the surface plate 5 is rotated in the direction of an arrow, the surface plate 1 is rotated in the direction of an arrow. The wafers 3 are abraised by the abrasing cloth 4. In this way, in order to prevent the rise in temperatures and to control the magnitude of strain, abrasing liquid 6 wherein abrasing particles are resolved is supplied, and a great deal of strain can be uniformly given to the back sides of the wafers 3. |
