| 摘要 |
<p>This invention provides a radiation-sensitive resin composition that is good in the shape of a pattern provided by a liquid immersion exposure method, is excellent in resolution and focal depth latitude, and is small in amount of eluate into a refractive liquid (immersion liquid) with which the composition has come into contact during liquid immersion exposure. The radiation-sensitive resin composition is used in the formation of a photoresist film by liquid immersion exposure lithography in which a radiation is applied in such a state that a liquid for liquid immersion exposure having a refractive index of more than 1.44 and less than 1.85 at a wavelength of 193 nm is interposed between a lens and a photoresist film. The radiation-sensitive resin composition comprises a resin and a radiation-sensitive acid generator. The resin comprises a repeating unit having a lactone structure, is insoluble or sparingly soluble in an alkali, and is rendered easily soluble in an alkali through the action of an acid.</p> |
