发明名称 IMAGE FORMING COMPOSITION AND FORMATION OF RESIST IMAGE
摘要 PURPOSE:To obtain a pattern of high accuracy by applying a soln. contg. a curable epoxy compound and a compound contg. a quinonediazido group to a substrate, drying the soln., imagewise exposing the resulting photosensitive material, heating it, and removing the exposed part by dissolution. CONSTITUTION:A soln. contg. a compound contg. a quinonediazido group such as benzoquinonediazido or naphthoquinonediazide by 10-40pts.wt. to 100pts.wt. of a curable epoxy compound such as bisphenol-A type epoxy resin or a glycidyl group- contg. monomer or (co)polymer is applied to a substrate of a metal such as Al or Cu or a silicon wafer and dried to form a photosensitive material. This material is imagewise exposed and uniformly heated to 110-220 deg.C to cure the unexposed part. The exposed part is then removed with a developer such a ethylene glycol monobutyl ether to obtain an image of high accuracy used in the manufacture of various electronic materials.
申请公布号 JPS56140342(A) 申请公布日期 1981.11.02
申请号 JP19800043384 申请日期 1980.04.02
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ISHIDA YUKIO;ISHII KEIZOU
分类号 G03C1/72;G03F7/023;G03F7/38;H01L21/027 主分类号 G03C1/72
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