| 摘要 |
PURPOSE:To improve the adhesion between an Au film and an insulating film on it coating a formed thin conductor film of multilayered structure, having the Au film by as the uppermost layer, with a thin insulating film in the same vacuum systum, by finely working the thin insulating film and thin metallic film in the same pattern, and by covering the entire surface with a thin insulating film. CONSTITUTION:On garnet film 1 for bubbles, thin insulating film 2 of SiO2 is formed in RF sputtering and on it, thin conductor metallic films 3 and 4 of Ta and Au constituting the double-layer structure are formed. In the same vacuum, auxiliary thin insulating film 5' of SiO2 is vapor-deposited. Insulating film 5' and thin metallic films 3 and 4 are formed in a desired pattern and on them, SiO2 insulating film 5 is formed by RF sputtering. Then, permalloy film 6 is provided over the entire surface and patterned by fine work tochnology. Thus, the adhesion between Au film 4 and insulating film 5' on it is improved. |
