WAFER CUTTING METHOD AND JIG FOR WAFER MULTI-BONDING

摘要

A wafer cutting method and jig for wafer multi-bonding is provided to reduce a wafer fabrication time and cost by arranging separated a plurality of insertion holes to be faced with each other. A plurality of wafers separated from the base substrate for the film growth is arranged. A plurality of arranged wafers(300) is welded, and the wafer welded by the multiple is processed to be the same size through one machining. The welded wafers are individually separated, and the arrangement of a plurality of wafers is performed through the separated jig of structure in which a plurality of insertion holes is spaced apart by the fixed interval. The azimuth plane of each wafer is in accord with the arrangement of a plurality of wafers. Wafer is the gallium nitride film or the thick film which grows from the different substrate or same substrate.