发明名称 ELECTROLESS PLATING APPARATUS
摘要 PURPOSE:To prevent the occurrence of metallic copper deposits in the solution by attaching an ultrasonic vibrator to the tip of the feed pipe for replenisher of an electroless copper plating apparatus to uniformly disperse a replenisher in a plating solu. in the plating vessel. CONSTITUTION:An electroless copper plating vessel is connected through circulating pipe 2, and a fresh electroless plating solu. in supplied from the replenisher tank 7 through pipe 12. At this time, ultrasonic vibrator 10 is attached to the tip of pipe 12 to apply ultrasonic vibration to the replenisher fed into pipe 2 from horn tip 11. By this vibration the replenisher is uniformly dispersed in and mixed with a plating bath in the vessel, so the occurrence of metallic copper deposits due to abnormal concn. of the bath is prevented.
申请公布号 JPS56139669(A) 申请公布日期 1981.10.31
申请号 JP19800042398 申请日期 1980.03.31
申请人 HITACHI CHEMICAL CO LTD 发明人 TSURU YOSHIYUKI;OKAMURA TOSHIROU;KAMIYAMA KOUJI
分类号 C23C18/16;C23C18/31;C23C18/40 主分类号 C23C18/16
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