发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To shorten the time of the step of connecting a fine metallic wire by operating the first bonding tool for a main electrode and the second bonding tool for a sub-electrode simultaneously or at a short time delay. CONSTITUTION:The first bonding tool 10 having a fine metallic wire 5 of large diameter for a cathode electrode 4a and the second bonding tool 11 having a fine metallic wire 7 of small diameter for a gate electrode 4b are provided, both the bonding tools 10, 11 are operated simultaneously or at a short time delay, the wire 5 connects the cathode electrode to a lead wire 6 in the sequence of (1), (2) and (3), and the wire 7 connects the gate electrode to a lead wire 8 in the sequency of (1) and (2). Thus, the time required for connecting the wires can be shortened.
申请公布号 JPS56138932(A) 申请公布日期 1981.10.29
申请号 JP19800042200 申请日期 1980.04.01
申请人 NIPPON ELECTRIC CO 发明人 FUJITA SHIGESHIZU
分类号 H01L21/60 主分类号 H01L21/60
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