| 摘要 |
PURPOSE:To prevent the abnormal connection of an element such as a diffused resistor or the like to an aluminum wire by rounding about the wire for connecting a bonding wire to the element in a linear IC and substantially increasing the length of the wire. CONSTITUTION:A rectangular bonding pad 1 is formed of an aluminum layer in the vicinity of a scribe region 3 of a silicon pellet 2 of a linear IC. Reference 4 is diffused resistor having a thickness of less than 1mu formed by selectively diffusing predetermined impurity in the pellet 2. An aluminum wire 5 having a shape rounding about in comb shape for connecting the contact hole 4a of the resistor 4 to the bonding pad 1 is formed. Since the length of the wire 5 is thus increased, it can prevent the permeation of the aluminum upon heat treatment, and prevent the abnormal contact alloy at the contact part. |
