发明名称 FORMING OF SEMICONDUCTOR
摘要 <p>PURPOSE:To dispense with a large-size heater and a control device by forming a semiconductor film through the attachment of a molten semiconductor particles on the surface of a substrate. CONSTITUTION:A SiO2 substrate 1 having a matrix-type unevenness is supported on a plate O and is kept at room temperature. Molten silicon particles 2 are injected from an irradiation gun 3 and applied as a coat. If the silicon particles 2 are attached on the surface of the substrate, the particles 2 are gradually cooled to form a monocrystal film. To the film thus obtained 4, impurities are added. Under this method, the silicon particles are gradually cooled in the same manner as a laser annealing process, so that the silicon particles are easily processd in large quantities and heater or a control device are dispensed with. Furthermore, a semiconductor film can be obtained for a substrate of large size.</p>
申请公布号 JPS56137612(A) 申请公布日期 1981.10.27
申请号 JP19800040511 申请日期 1980.03.31
申请人 CHO LSI GIJUTSU KENKYU KUMIAI 发明人 IWAMATSU SEIICHI
分类号 H01L29/78;H01L21/20;H01L21/208;H01L29/786 主分类号 H01L29/78
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