发明名称 CONDENSER FOR BOILING TYPE COOLING APPARATUS
摘要 <p>PURPOSE:To cool a semiconductor, an electrical apparatus and an electric car, etc. effectively by a method wherein a partition wall dividing a refrigerant vapor supply passage from a refrigerant liquid return passage has a falling form and a communicating hole is provided at its lowermost part to join these two passages. CONSTITUTION:The inner part of a header chamber 17 is divided by a partition wall 19 composed of a vertical partition wall 19A and a V-form inclined partition wall 19B into a refrigerant vapor supply passage 11 and a refrigerant liquid return passage 12 and both these passages 11, 12 are connected through a communicating passage 20 provided at the bottom of the partition wall 19. By this structure, the refrigerant vapor produced in an evaporator 2 flows into the refrigerant vapor supply passage 11 through heat transportation pipes 4 and separately into the condensing pipes 7 which line up vertically on both sides. Liquefied refrigerant is returned from another header chamber to a liquid reservoir 13 through the condensing pipe 7, the refrigerant liquid return passage 12, the communicating hole 20. Thus, a semiconductor, an electrical apparatus, etc. can be cooled effectively, This condenser can be used for an electric car etc. without deterioration of cooling performance.</p>
申请公布号 JPS56137086(A) 申请公布日期 1981.10.26
申请号 JP19800040638 申请日期 1980.03.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIKANE TOSHIO;KAMEDA TAKU;TETSUNO HARUO
分类号 H01L23/427;F28D15/02 主分类号 H01L23/427
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