| 摘要 |
The invention relates to a thin-film circuit configuration in which a thin layer (film) consisting of aluminium is deposited on a thin resistive film, e.g. consisting of a nickel-chromium alloy. At least the electrical connection elements between the aluminium layer and the components of the electrical circuit configuration likewise consist of aluminium, for example aluminium wires which are directly bonded to the thin highly conductive aluminium film, employing ultrasonic or thermal compression-bonding techniques. This avoids the formation of undesirable intermetallic compounds to any significant extent in these bonding zones, so that reliable, good bonds are achieved.
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