| 摘要 |
PURPOSE:To enhance the reliability of connection of an element by a method wherein a lead having a cut-out in the center thereof is made to bestride over a window for a semiconductor element device provided in a film, the semiconductor element is pressed on a lead terminal for connection and the lead is cut simultaneously. CONSTITUTION:The lead 4 with Sn plating and Cu leaf is arranged in the central part of a polyimide film 1 with a number of sprocket holes 2 at both end parts thereof, being made to bestriding the window 3 wherein the semiconductor element is fitted. In the central part of the bridging part of the lead the cut part 4a is made so that it can be cut with ease. When the Au bump of the semiconductor device is matched in position with a part projected from the window and pressed thereon by heating by means of a bonding tool, a tape is broken at the cut part and simultaneously the semiconductor element is bonded to the lead terminal. By this constitution, the reliability of connection of the lead terminal to the semiconductor element is increased. |
