| 摘要 |
A printed circuit board package structure 100 includes a substrate 110, plural ring-shaped magnetic elements 130, a support layer 140, and first conductive layers 160, 162, 164. The substrate has two opposite first and second surfaces 112, 114, first ring-shaped recesses 116, and first grooves 118. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings 119. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes 150. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes. |
