发明名称 COOLING DEVICE BY BOILING
摘要 PURPOSE:To obtain a stable cooling performance by providing a cooler between a liquid reservoir and a suction-discharge pipe to prevent flow-out of a refrigerant from the liquid reservoir due to overheat of a heating body or the like in a circulation device wherein cooling is made by liquefying heated refrigerant vapor through condensation. CONSTITUTION:When the heating body 9 such as a semiconductor element and an electronic apparatus starts to heat and thereby the temperature rises, refrigerant vapor 7c is generated from refrigerant liquid 7a, goes into a condensor 3 through a vapor pipe 2 and is liquefied through condensation in the condensor, and refrigerant liquid 7d returns into an evaporator 1 through a return pipe 4. The heating body 9 is cooled by this circulation. When the heating body is overheated and the vapor penetrates into the liquid reservoir 6 through a connecting pipe 5, sealing by the liquid 8 turns impossible and the liquid flows out to the suction-discharge pipe 10. On this occasion, the refrigerant vapor is liquefied by a cooler 11 provided between the pipe and the liquid reservoir and connected with a refrigerator 12 and is returned to the reservoir 6 from the return pipe 12. By this constitution, the cooling device by boiling having the constantly stable cooling performance can be obtained.
申请公布号 JPS56135950(A) 申请公布日期 1981.10.23
申请号 JP19800038909 申请日期 1980.03.28
申请人 HITACHI LTD 发明人 OKADA TEIGO;SONOBE HISAO
分类号 F25D9/00;H01L23/427;H01L23/44 主分类号 F25D9/00
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